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RELIFE RL-406 227℃ Lead-Free Hight Temperature Solder Paste Middle Layer Tin Planting For Iphone 12Pro Max Motherboard Repair

500.00

PRODUCT DETAILS

Item specifics
Brand Name:wozniak
DIY Supplies:ELECTRICAL
Type:Combination
Origin:CN(Origin)
Model Number:RELIFE RL-406
Package:Bag
is_customized:No
Application:Computer Tool Kit
Model Number:For iphone 12 pro BGA Reballing
Application:For iphone 12pro max Circuit Board
Application1:Repair mainboard Location
Application2:For iphone 12 promax Special solder paste
type:rl-406
weight:38g

PRODUCT DETAILS

Item specifics
Brand Name:wozniak
DIY Supplies:ELECTRICAL
Type:Combination
Origin:CN(Origin)
Model Number:RELIFE RL-406
Package:Bag
is_customized:No
Application:Computer Tool Kit
Model Number:For iphone 12 pro BGA Reballing
Application:For iphone 12pro max Circuit Board
Application1:Repair mainboard Location
Application2:For iphone 12 promax Special solder paste
type:rl-406
weight:38g

RELIFE RL-406 227℃ Lead-Free Hight Temperature Solder Paste Middle Layer Tin Planting For Iphone 12Pro Max Motherboard PCB Repair

RELIFE RL-406 high temperature lead-free tin paste (containing silver)
. 227°C high temperature lead-free tin paste suitable for IP12/12Pro/12Pro Max middle layer tin planting
. Silver, lead free, high purity

Weight 0.1 kg